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Raw materials for electronics and laminates

Laminating, potting and electronic coating producers use our epoxy resins, microspheres and low-conductivity fillers.

What this industry struggles with

  • Electrical insulation with reliable thermal and dimensional stability.
  • CTE matching between resin and copper or ceramic substrates.
  • Consistent dielectric performance across lots.

How we solve it

  • Low-molecular epoxy resin grades for laminating and insulation systems with high crosslink density.
  • Hollow glass microspheres for weight reduction in potting compounds.
  • Documentation for each lot, including batch traceability for qualification files.

Main applications

Copper clad laminatesPotting and encapsulationConformal coatingsInsulating varnishesLightweight potting fillers

Grades commonly used in this industry

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Tell us the grade you use today, your process step and your target cost. We will come back with alternatives and a testing plan.

COA + MSDS with every shipment