Nan Ya NPES 901 Epoxy Resin - Low-Molecular Solid Bisphenol A Epoxy for Anti-Corrosive Coatings & Prepreg Laminating

Full Name: NPES 901 Low Molecular Weight Solid Bisphenol A Epoxy Resin Entry-level low molecular solid epoxy resin synthesized from liquid DGEBA bisphenol A raw material. Features high epoxy group density, fast crosslink reaction and ultra-strong substrate adhesion, specially developed for solvent-based anti-corrosion baking coatings, fiber prepreg and insulating laminates. Solvent-soluble versions (Xylene / BCS solution) are available for liquid paint production. Core Technical Parameters Epoxy Equivalent Weight (EEW) 450 ~ 500 g/eq Softening Point 64 ~ 74 ℃ Solution Viscosity (40% Butyl Carbitol, 25℃) D ~ G Gardner Viscosity Gardner Color ≤1.0 Volatile Content ≤1.0 % Physical Form Pale yellow transparent solid flakes Standard Pack 25kg/bag CAS No. 25036-25-3   Core Advantages 1.  Low molecular weight brings high crosslink density after curing, outstanding anti-corrosion, acid & alkali resistance for metal substrates. 2.  Ultra-strong adhesion on steel, aluminum, copper, glass fiber and plastic base materials, no film peeling under harsh environment. 3.  Low softening point, easy dissolving in xylene, BCS and ketone solvents, low energy consumption for liquid paint production. 4.  Stable batch color with light Gardner hue, won’t cause yellow discoloration for light-colored anti-rust coatings. 5.  Compatible with amine, amide and anhydride curing agents, wide formula adjustment window for liquid baking paint systems. Main Application Fields Core Applications: Solvent-based industrial anti-corrosion baking coating, fiber glass prepreg, electrical insulating laminates Compatible Applications: Metal primer, epoxy ester intermediate resin, two-component solvent adhesive Forbidden Scenarios: Food contact coatings, high soft-touch powder coatings, high-flexibility can interior coating Handling Precautions 1.  Standard mixing ratio matched with amine curing agent: Epoxy : Curing Agent = 3:1 ~ 5:1, adjust per target hardness. 2.  Seal and store in cool dry warehouse below 30℃, avoid direct sunlight to prevent agglomeration. 3.  Dissolve with high-speed disperser at 60~80℃ to shorten dissolution time fully. 4.  Wear chemical resistant gloves & goggles during feeding; avoid long-term skin contact with molten resin.